International Facility

Equipment

Pick and Place
AOI (Automated Optical Inspection)
3D X-ray
10 Zone Reflow Ovens

Capabilities

Fully-automated High speed lines (SMT and Through-hole)

Our SMT and through-hole lines are fully automatic, with your product carried by conveyor through the entire assembly process. With separate lines for leaded and unleaded components, our lines are fast, efficient and perfect for higher-volume orders.

Rigid, semi-rigid, flex circuit and aluminum substrate capabilities

Our technical staff members are familiar with rigid, semi-rigid, flex circuit and aluminum substrate assembly. We can recommend which type of circuit would be appropriate for your product during the design and development stage.

BGA, fine pitch, QFN placement repair and rework capabilities

DataED has experience with Ball Grid Array (BGA) surface-mount packaging, Fine Pitch board-to-board connector assembly and Quad Flat No-Lead (QFN) fabrication, repair, and rework.

Full testing capabilities (ICT and Functional) and 3D X-ray

We offer a variety of automated test and inspection techniques to find manufacturing and functionality defects before they become a bigger problem at the mass production stage, including In-Circuit Test (ICT) systems, Functional Testing and 3D x-ray inspection.

Box build and sub-assembly capabilities

Box build assembly and sub-assembly is one of DataED’s specialties. Our flexibility and adaptability allows to configure to meet any box build needs.

Order fulfillment services

DataED will ensure your product is built, tested, and packaged to your exact specification for delivery to the end customer.

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Let's Talk

At DataED, we believe trusted service begins with transparency. We encourage open and honest communications among employees, business partners and customers. Give us a call or send us a message below and let’s get the dialogue started!

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