Fully-automated lines for leaded and non-leaded assemblies
DataED’s fully automated assembly lines are fast and efficient, for leaded and non-leaded component assembly. Our highly-trained technical staff is knowledgeable on both chemistries and would be happy to make a recommendation as to what would be the right choice for your product.
Rigid, semi-rigid, flex circuit and aluminum substrate capabilities
Our technical staff members are familiar with rigid, semi-rigid, flex circuit and aluminum substrate assembly. We can recommend the type of circuit that would be appropriate for your product during the design and development stage.
BGA, fine pitch, QFN placement repair and rework capabilities
DataED has experience with Ball Grid Array (BGA) surface-mount packaging, Fine Pitch board-to-board connector assembly and Quad Flat No-Lead (QFN) fabrication, repair and rework.
Full testing capabilities (ICT and Functional) and 3D X-ray
We offer a variety of automated test and inspection techniques to find defects and add quality, including In-Circuit Test (ICT) systems, Functional Testing, flying probe and 3D x-ray inspection.
Test design assistance
We will assist in the design of any ICT, functional or systems test requirements.
Box build and sub-assembly capabilities
Box build assembly and sub-assembly is one of DataED’s specialties. Our flexibility and adaptability allows to configure to meet any box build needs.
At DataED we believe trusted service begins with transparency. We encourage open and honest communications among employees, business partners and customers. Give us a call or send us a message below and let’s get the dialogue started!